Taiwanese Semiconductor Manufacturer Speeds Up Timeline For New Facility
Taiwan Semiconductor Manufacturing Co. is accelerating the timeline for development of its massive chip fabrication plant cluster in Phoenix, according to an Axios report.
On an earnings call in early January, TSMC Chairman and CEO Che-Chia Wei said the company now aims to open its second Phoenix fab ahead of schedule in 2027.
The original timeline called for the facility to open in 2028. TSMC completed its first plant, at 3.5M SF, in 2024.
In March 2025, TSMC said it had committed a second round of funding of $100B to develop its “gigafab” cluster — which consists of six fabrication plants, two advanced packaging facilities and a research and development center — in the northern Phoenix area.
The third plant is currently under construction, with the semiconductor company working to secure permits to break ground on its fourth.
In total, the company has committed $165B to the project.
TSMC also recently closed on a second piece of land in Phoenix, Wei said.
The news comes just days before the U.S. Department of Commerce announced a broader trade deal with Taiwan mandating Taiwanese semiconductor companies invest an additional $250B in American facilities.
